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Complete Teardown of Intel’s RealSense D435 3D Active IR Stereo Depth Camera – ResearchAndMarkets.com

The “Intel
RealSense D435 3D Active IR Stereo Depth Camera Complete Teardown Report”
report has been added to ResearchAndMarkets.com’s
offering.

Integrated in a compact aluminum case, the Intel RealSense D435 is an
intelligent USB-C powered 3D active infra-red global shutter stereo
depth camera. It combines a conventional red/green/blue (RGB) color
sensor, a vertical-cavity surface-emitting laser (VCSEL) projector and
left- and right-side imagers for stereo vision.

The 3D camera has a minimum depth of 0.2m and can scan environments up
to 10m wide with a resolution depth of up to 1280720 at 90 frames per
second (fps). The system uses a 28nm Intel D4 vision processor for
processing complex depth data in real time and a Realtek color image
processor.

The infrared laser projector is tiny, measuring only 2.7mm x 1.8mm, uses
VCSEL technology and can record 60fps. Omnivision supplies the three
image sensors; a CMOS 1080p RGB sensor and twin 1-megapixel sensors for
the left and right side imagers.

The components and sensors are contained in ball grid array (BGA) and
wafer level packaging, all mounted on two single-sided boards whose
total surface area is less than 20cm.

Based on a complete teardown analysis of the RealSense D435, the report
provides high definition pictures of the vision processor, VCSEL IR
projector and image sensor dies as well as the bill-of-material (BOM)
and the manufacturing cost of the depth module.

Key Topics Covered:

1. Intel Company Profile, Camera Main Features and Main Chipset

2. Physical Analysis

3. Cost Analysis

4. Estimation of the Selling Price – Intel

For more information about this report visit https://www.researchandmarkets.com/research/pdgnvk/complete_teardown?w=4

View source version on businesswire.com: https://www.businesswire.com/news/home/20180619005599/en/