iPhone X Teardown and Identification of Key Components Complete Teardown
Report” report has been added to ResearchAndMarkets.com’s
Through a teardown of the Apple iPhone X, this report details more than
50 integrated circuit (IC) devices from the main boards.
It will help you to identify the manufacturer, packaging, including the
size, type, and pitch, and function of the iPhone X’s main ICs. A
physical analysis of the main substrates highlights internal structures
and technologies used for the printed circuit boards (PCBs).
The report includes teardown photos, detailed package identification and
descriptions and is supplied with an Excel file summarizing the iPhone
X’s chipset and breakdowns by supplier, package or footprint.
Key Topics Covered:
2. Executive Summary
3. Physical Analysis
For more information about this report visit https://www.researchandmarkets.com/research/4czcr2/complete_teardown?w=4
View source version on businesswire.com: https://www.businesswire.com/news/home/20180619005614/en/