TAINAN, Taiwan, June 19, 2018 (GLOBE NEWSWIRE) — Himax Technologies, Inc. (Nasdaq:HIMX) (“Himax” or “Company”), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today declared a cash dividend of 10 cents per ADS, equivalent to 5 cents per ordinary share, for the year of 2017.
The cash dividend will be payable on July 31, 2018 to all the shareholders of record as of July 19, 2018. The ADS book will be closed for issuance and cancellation from July 12, 2018 to July 19, 2018. Typically, Himax pays out its yearly dividend at approximately the middle of its current calendar year based on the Company’s previous year’s financial performance.
“Since our IPO in 2006, we have remained committed to a dividend policy,” said Mr. Jordan Wu, President and Chief Executive Officer of Himax Technologies, Inc. “This year’s dividend represents a payout ratio of 61.7% based on our fiscal year 2017 profit. The high payout ratio demonstrates our continued support of our shareholder base and strong confidence in the outlook for 2018 and beyond. As reported in the last few earnings calls, we are investing a total of $105 million of the Phase I capital expenditure for new building’s construction, WLO capacity expansion and installation of active alignment equipment to support our 3D sensing business. Our decision for the high dividend payout ratio, notwithstanding the high capital expenditure this year, reflects our confidence on the healthy balance sheet, cash flow and the strong return expected of such expansion.”
About Himax Technologies, Inc.
Himax Technologies, Inc. (NASDAQ:HIMX) is a fabless semiconductor solution provider dedicated to display imaging processing technologies. Himax is a worldwide market leader in display driver ICs and timing controllers used in TVs, laptops, monitors, mobile phones, tablets, digital cameras, car navigation, virtual reality (VR) devices and many other consumer electronics devices. Additionally, Himax designs and provides controllers for touch sensor displays, in-cell Touch and Display Driver Integration (TDDI) single-chip solutions, LED driver ICs, power management ICs, scaler products for monitors and projectors, tailor-made video processing IC solutions, silicon IPs and LCOS micro-displays for augmented reality (AR) devices and heads-up displays (HUD) for automotive. The Company also offers digital camera solutions, including CMOS image sensors and wafer level optics for AR devices, 3D sensing and machine vision, which are used in a wide variety of applications such as mobile phone, tablet, laptop, TV, PC camera, automobile, security, medical devices and Internet of Things. Founded in 2001 and headquartered in Tainan, Taiwan, Himax currently employs around 2,200 people from three Taiwan-based offices in Tainan, Hsinchu and Taipei and country offices in China, Korea, Japan, Israel and the US. Himax has 3,005 patents granted and 444 patents pending approval worldwide as of March 31st, 2018. Himax has retained its position as the leading display imaging processing semiconductor solution provider to consumer electronics brands worldwide.
Forward Looking Statements
Factors that could cause actual events or results to differ materially include, but not limited to, general business and economic conditions and the state of the semiconductor industry; market acceptance and competitiveness of the driver and non-driver products developed by the Company; demand for end-use applications products; reliance on a small group of principal customers; the uncertainty of continued success in technological innovations; our ability to develop and protect our intellectual property; pricing pressures including declines in average selling prices; changes in customer order patterns; changes in estimated full-year effective tax rate; shortages in supply of key components; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; our ability to collect accounts receivable and manage inventory and other risks described from time to time in the Company’s SEC filings, including those risks identified in the section entitled “Risk Factors” in its Form 20-F for the year ended December 31, 2017 filed with the SEC, as may be amended.