P20 Pro Teardown and Identification of Key Components Complete Teardown
Report” report has been added to ResearchAndMarkets.com’s
Discover Huawei’s key devices, advanced packaging technical choices and
Through a teardown of the Huawei P20 Pro, this report details more than
100 integrated circuit (IC) devices used in the cellphone’s main boards.
It will help you to identify the manufacturer and packaging, including
its size, type and pitch, and function of the P20 Pro’s main ICs. A
physical analysis of the main substrates highlights internal structures
and technologies used for the printed circuit boards (PCBs).
The report includes teardown photos, detailed package identification and
descriptions and is supplied with an Excel file summarizing the P20 Pro
chipset and breaking it down by supplier, package or footprint.
Key Topics Covered:
2. Executive Summary
3. Physical Analysis
For more information about this report visit https://www.researchandmarkets.com/research/f8kdzr/huawei_p20_pro?w=4
View source version on businesswire.com: https://www.businesswire.com/news/home/20180619005619/en/