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MEMS Pressure Sensor Comparison Report 2018: Analysis and Comparison of 34 Devices – ResearchAndMarkets.com

The “MEMS
Pressure Sensor Comparison 2018 Complete Teardown Report”
report has been added to ResearchAndMarkets.com’s
offering.

The MEMS pressure sensor market is still driven by automotive
applications, but the consumer market has advanced to second place.

The report provides insights into the structures, technical choices,
designs, processes, supply chain positions and costs of seven consumer,
14 industrial and 13 automotive MEMS pressure sensor products from the
leading suppliers. The suppliers include All Sensors, Amphenol, APM,
Bosch, Denso, First Sensor, Fuji Electric, Freescale, Honeywell,
Infineon, Melexis, Merit SensorSystems, Mitsubishi Electric, Nagano
Keiki, Sensata, Sensirion, SMI and STMicroelectronics.

We analyze and compare 34 devices that use piezoresistive or capacitive
technology, manufactured with bulk micromachining or surface
micromachining processes, first level packaging or module packaging,
monolithic or multi-chip structures. We look at their package dimensions
and internal structures, MEMS and application specific integrated
circuit (ASIC) dies, die dimensions and package cross-sections, to
provide a comprehensive review of MEMS pressure sensors.

MEMS pressure devices’ packaging and pressure range differ widely
according to application. In more than 150 pages, this report includes
multiple comparisons based on physical analyses of 34 MEMS pressure
sensor components. It offers buyers and device manufacturers the unique
possibility of understanding MEMS pressure sensor technology evolution,
and comparing product costs.

Key Topics Covered:

1. Overview / Introduction

2. Structure, Process and Cost Review

For more information about this report visit https://www.researchandmarkets.com/research/wb4d3m/mems_pressure?w=4

View source version on businesswire.com: https://www.businesswire.com/news/home/20180619005601/en/