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Samsung’s Galaxy S9 Plus Processor Packages – Complete Teardown Report – ResearchAndMarkets.com

The “Samsung’s
Galaxy S9 Plus Processor Packages Complete Teardown Report”
report has been added to ResearchAndMarkets.com’s
offering.

In the high end smartphone market four manufacturers, Apple, Samsung,
Huawei and Qualcomm, lead in the Application Processor Environment (APE)
stakes. All four have a different supply chain but all remain
competitive. Samsung is the only one present in two different supply
chains. It provides the APE for its own flagship but it also provides
the APE die for Qualcomm.

Since 2016, the Galaxy smartphone series has featured the two APEs
depending on where in the world they’re sold. This year Samsung renewed
this partnership by integrating the Exynos 9 with several innovations
like modified semi-additive process (mSAP) printed circuit board (PCB)
or new package-on-package (PoP) integration developed by Samsung itself
or the Qualcomm Snapdragon 845 with Molded Core Embedded Package (MCeP)
developed by Shinko.

Depending on where in the world it’s sold, the Samsung Galaxy S9 Plus
has several features that can differ. The international’ version
features an Exynos 9810 chipset with mSAP technology for the main board
PCB while the US version features the Snapdragon 845 chipset with
standard main board PCB.

The Exynos 9810 is an embedded die package with in-house packaging
technology, using two moldings to improve the well-known Through Molded
Via (TMV) technology. The Snapdragon 845 still uses Shinko’s MCeP
technology, but with new improvement since the last analyzed Snapdragon
APE. In this report, we will show the differences between both packages
and their innovations, including molding compound, substrate and
decoupling capacitors. The detailed comparison between both APE packages
will give the pros and the cons of the PoP technologies.

This report reviews the Exynos 9810 and the Snapdragon 845, including a
complete package analysis, cost analysis, and price estimate for the
chips. Also included is a physical and cost comparison of the different
solutions. Finally, it features a technical and physical comparison
between the previous generation of the Exynos and the Snapdragon Series,
and the other APE packaging solutions from Huawei and Apple.

Key Topics Covered:

1. Overview/Introduction

2. Samsung and Qualcomm – Company Profiles

3. Samsung Galaxy S9+ Teardown – US vs. EU versions

4. Exynos and Snapdragon Physical Analysis

5. Physical and Cost Comparison

6. Manufacturing Process Flow

7. Cost Analysis

8. Estimated Price Analysis

Companies Mentioned

For more information about this report visit https://www.researchandmarkets.com/research/7frk3d/samsungs_galaxy?w=4

View source version on businesswire.com: https://www.businesswire.com/news/home/20180619005590/en/