Silicon Carbide (SiC) MOSFET Market Report 2018 with Complete Bill of Materials, Die Manufacturing, and Packaging Processes

Dublin, June 19, 2018 (GLOBE NEWSWIRE) — The “Silicon Carbide (SiC) MOSFET Complete Teardown Report” report has been added to ResearchAndMarkets.com’s offering.

The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016-2020. This will increase to 40% from 2020-2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022.

In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.

Littelfuse, Inc., a leader in circuit protection, recently introduced its first series of silicon carbide (SiC) MOSFETs. This is the latest addition to the company’s power semiconductor line, realized through a majority investment in Monolith Semiconductor Inc., a SiC technology development company.

The LSIC1MO120E0080, with a voltage rating of 1200V and ultra-low (80m?) on-resistance, is the first organically designed, developed, and manufactured SiC MOSFET to be released by this partnership, using all of X-Fab’s know-how and experience, along with its 150mm SiC production line in Lubbock.

Supported by a full component and package teardown, this report reveals Littelfuse’s innovative assets, which bring several advantages to the 1200V SiC MOSFET: most notably, superior gate-oxide reliability, switching performance, and conduction losses.

This report also details the complete bill of materials (BoM), die manufacturing, and packaging processes. Included too are an estimated manufacturing cost, a comparison with similar products from STMicroelectronics and CREE, and an estimated sales price of the Littelfuse component.

Key Topics Covered:


  • Executive Summary
  • Reverse Costing Methodology

Company Profile

  • Littelfuse Semiconductor

Physical Analysis

  • Synthesis of the Physical Analysi
  • Package Analysis
    • Package opening
    • Package cross-section
  • MOSFET Die
    • MOSFET die – view and dimensions
    • MOSFET – die process
    • MOSFET – die cross-section
    • MOSFET – die process characteristics

MOSFET Manufacturing Process

  • MOSFET Die – Front-End Process
  • MOSFET Die – Fabrication Unit
  • Final Test and Packaging – Fabrication Unit

Cost Analysis

  • Synthesis of the Cost Analysis
  • Yields Explanation and Hypotheses
  • MOSFET Die
    • MOSFET – front-end cost
    • MOSFET – die probe test, thinning and dicing
    • MOSFET – wafer cost
    • MOSFET – die cost
  • Complete MOSFET
    • Assembled components cost
    • Synthesis of the assembly
    • Component cost

Price Analysis

  • Estimated Sales Price


  • 1200V CREE and STMicroelectronic SiC MOSFET Comparison
  • SiC vs IGBT Comparison

For more information about this report visit https://www.researchandmarkets.com/research/zs85n4/silicon_carbide?w=12

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